发明名称 SEMICONDUCTOR DEVICE HAVING PROTECTIVE LAYER FOR REDUCING I/O PAD AND FUSE THICKNESS DAMAGE AND MANUFACTURING METHOD THEREOF
摘要 A semiconductor device having a thickness damage blocking layer for an input/output pad and a fuse is provided to make a fuse perform its own function by obtaining a pattern in which the thickness of an input/output pad and a fuse is not damaged. A first interlayer dielectric is formed in first and second regions on a substrate. A metal layer(230) is formed on the insulation layer. A second interlayer dielectric is formed on the metal layer. A pad vertically penetrates the second interlayer dielectric in the first region, electrically connected to the metal layer. An insulation passivation layer is formed on the pad and the second interlayer dielectric, made of a silicon oxide layer. A damage preventing layer is formed on the insulation passivation layer, made of a silicon nitride layer or a silicon oxide layer. A final passivation layer is formed on the damage preventing layer, made of a polyimide layer. An opening(280e,280f) is formed in a manner that the final passivation layer, the damage preventing layer and the insulation passivation layer expose the pad and the metal layer in the second region.
申请公布号 KR20070059384(A) 申请公布日期 2007.06.12
申请号 KR20050118172 申请日期 2005.12.06
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JI, HYUN SEOK
分类号 H01L21/82 主分类号 H01L21/82
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