| 摘要 |
A method for polishing double sides of a silicon wafer is provided to improve localized light scatters by adding a process of supplying a final slurry onto the wafer after a stock slurry polishing process. A stock slurry is supplied onto a silicon wafer during a predetermined time to carry out a primary polishing process(110). The stock slurry is supplied onto the silicon wafer during a predetermined time to carry out a secondary polishing process(120). A final slurry for managing localized light scatters is supplied onto the silicon wafer during a predetermined time to carry out a third polishing process(130). Deionized water is supplied onto the silicon wafer during a predetermined time to carry out a fourth polishing process(140). Surfactant is supplied onto the silicon wafer during a predetermined time to carry out a fifth polishing process(150).
|
