发明名称 DIFFUSION APPARATUS AND METHOD FOR CONNECTING A TURBO VACUUM PUMP USING THE SAME
摘要 A diffusion device for fabricating a semiconductor device and a method for connecting a vacuum pump thereof are provided to prevent leakage of vacuum from a turbo vacuum pump to a first movable connection port via a second vacuum pump. A heat part is installed on one end of a bell shaped diffusion furnace used for fabricating a semiconductor device. A first connection port is installed on a flange of the heater part to connect a vacuum pump. A movable part(62) is installed on one end of the first connection port to move a second connection port of the vacuum pump. The movable part has a safety link(70) for preventing release of the second connection port, and a fixing portion(64) connected to a handle of the movable part.
申请公布号 KR20070058248(A) 申请公布日期 2007.06.08
申请号 KR20050116639 申请日期 2005.12.01
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, JUNG NAM
分类号 H01L21/02 主分类号 H01L21/02
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