| 摘要 |
A substrate cleaning method is provided to effectively remove the particles on a substrate while the substrate is controlled to be damaged in an allowable range, by using as a liquid of two-fluid spray a mixture liquid of deionized water and isopropyl alcohol wherein the density of the isopropyl alcohol in the mixture liquid is 10~60 volume percent. Two-fluid spray composed of liquid and gas is supplied to the surface of a substrate. The two-fluid spray uses as the liquid a mixture solution of deionized water and isopropyl alcohol wherein the density of the isopropyl in the mixture solution is 10~60 volume percent and a particle removal rate is 80 % or higher. The substrate is rotated to remove the liquid remaining on the substrate.
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