| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for improving the versatility of a resin sheet, making constant the shape of a packaging end face to be obtained, and miniaturizing a device in the sealing method of a semiconductor element using the resin sheet, and to reduce costs and improve quality in the manufacture of a semiconductor device. SOLUTION: The manufacturing method of semiconductor devices includes a process for preparing a circuit board where a plurality of semiconductor chips are mounted; a process for burying a sealing resin layer of a resin sheet for sealing semiconductors comprising a support sheet, and a thermosetting sealing resin layer laminated separably on the entire surface of one surface of the support sheet into irregularities and gaps on the semiconductor chip mounting surface of the circuit board, thus bringing the sealing resin layer surface into contact with a circuit board surface; and a process for cutting the circuit board with the sealing resin layer for each semiconductor chip. The sealing resin layer is thermally cured after the process for bringing the sealing resin layer surface into contact with the circuit board surface and/or the process for cutting the circuit board with the sealing resin layer for each semiconductor chip. COPYRIGHT: (C)2007,JPO&INPIT
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