| 摘要 |
An image sensor module comprises an image sensor including a pixel region picking up an image from light incident from the outside and a signal processing region having bumps formed in the outer portion of the image sensor so as to process an electrical signal with respect to the image picked up by the pixel region; and a board attached to the image sensor by a liquid adhesive and provided with a window such that the pixel region of the image sensor receives light, the board including: a first dummy pattern formed on at least a portion around the window; a circuit pattern formed in a position spaced in a predetermined distance outward from the first dummy pattern; and board-side pads electrically connected to the circuit pattern so as to come in contact with the bumps formed in the image sensor.
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