| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which improves its reliability by suppressing the swelling of a solder resist layer located on dummy inner leads. SOLUTION: A film base 20 has a device hole 20a, inner leads 21 the ends 21a of which extend into the device hole 20a, dummy inner leads 22 one ends 22a of which extend into the device hole 20a and another ends 22b of which are folded back toward the device hole 20a, and a solder resist layer 23. A semiconductor chip 10 disposed in the device hole 20a has outside connecting terminals 11 bonded to the ends 21a of the inner leads 21 and dummy outside connecting terminals 12 bonded to the first ends 22a of the dummy inner leads 22. COPYRIGHT: (C)2007,JPO&INPIT
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