| 摘要 |
PROBLEM TO BE SOLVED: To provide a simple and compact expand ring capable of expanding a sheet adhered to the rear surface of a wafer, maintaining the expanded state with the interval between chips expanded, and being housed in a cassette of the wafer. SOLUTION: The expand ring 10 comprises a ring body 12 having its external diameter smaller than an internal diameter of the ring member, and a jutting piece 14 extended from an upper edge to the outside down below of the ring body and having the external diameter of the top end part larger than the inner diameter of the ring member. When the expand ring 10 is pressed into the sheet material S from its lower side and the sheet material S is expanded by the tensile force, the jutting piece 14 is bent downward and its top end part climbs over the internal diameter portion of the ring member F, and after that, the jutting piece 14 restores its bending, the top end part of the jutting piece 14 is engaged with the upper surface of the ring member F through the sheet material S to maintain the expanded state of the sheet material S. COPYRIGHT: (C)2007,JPO&INPIT |
