| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing having high flame retardancy, excellent high temperature preserving properties and environmental safety, and advantageous high temperature reflow resistance and other properties; and a high reliable semiconductor device sealed with the resin composition for sealing. SOLUTION: This resin composition for sealing comprises: (A) an epoxy resin; (B) a nitrogen modified phenol resin-based curing agent; (C) aluminum hydroxide; and (D) an inorganic filler, wherein aluminum hydroxide of the component (C) has a Na<SB>2</SB>O content of 0.1% by weight and an inorganic filler of the component (D) has an average particle diameter of 1 to 60μm and a maximum particle diameter of 200μm or less, and contains substantially no halogen-based flame retardant and no antimony-based flame retardant, and this semiconductor device is a semiconductor device in which a semiconductor element is sealed with a cured form of the resin composition for sealing. COPYRIGHT: (C)2007,JPO&INPIT
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