SUBSTRATE PROCESSING APPARATUS

摘要

Provided is a substrate processing apparatus for processing a substrate by using a processing solution oscillated with ultrasonic waves. The processing apparatus is provided with an oscillating body (32), which is a rectangular parallelepiped with a supply path (35) which opens at a lower plane of one end portion in the longitudinal direction and inclined toward the other end portion in the longitudinal direction; an oscillator (34) arranged on an upper plane of the oscillating body and oscillating the oscillating body with ultrasonic waves; and a heat exchanger (42) for cooling the processing solution supplied to the supply path.