发明名称 Laser beam machining method
摘要 A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region 7 formed by multiphoton absorption forms a cutting start region 8 within an object to be processed 1 along a line to cut 5 . Thereafter, the object 1 is irradiated with laser light L 2 absorbable by the object 1 along the line to cut 5 , so as to generate fractures 24 from the cutting start region 8 acting as a start point, whereby the object 1 can accurately be cut along the line to cut 5 . Expanding an expandable film 19 having the object 1 secured thereto separates individual chips 25 from each other, which can further improve the reliability in cutting the object 1 along the line to cut 5.
申请公布号 US2007125757(A1) 申请公布日期 2007.06.07
申请号 US20030548412 申请日期 2003.03.12
申请人 FUKUYO FUMITSUGU;FUKUMITSU KENSHI;UCHIYAMA NAOKI;WAKUDA TOSHIMITSU;ATSUMI KAZUHIRO;MURAMATSU KENICHI 发明人 FUKUYO FUMITSUGU;FUKUMITSU KENSHI;UCHIYAMA NAOKI;WAKUDA TOSHIMITSU;ATSUMI KAZUHIRO;MURAMATSU KENICHI
分类号 B23K26/38;B23K26/06;B23K26/40;B23K26/42;B28D1/22;B28D5/00;C03B33/023;C03B33/09 主分类号 B23K26/38
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