发明名称 |
Laser beam machining method |
摘要 |
A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region 7 formed by multiphoton absorption forms a cutting start region 8 within an object to be processed 1 along a line to cut 5 . Thereafter, the object 1 is irradiated with laser light L 2 absorbable by the object 1 along the line to cut 5 , so as to generate fractures 24 from the cutting start region 8 acting as a start point, whereby the object 1 can accurately be cut along the line to cut 5 . Expanding an expandable film 19 having the object 1 secured thereto separates individual chips 25 from each other, which can further improve the reliability in cutting the object 1 along the line to cut 5.
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申请公布号 |
US2007125757(A1) |
申请公布日期 |
2007.06.07 |
申请号 |
US20030548412 |
申请日期 |
2003.03.12 |
申请人 |
FUKUYO FUMITSUGU;FUKUMITSU KENSHI;UCHIYAMA NAOKI;WAKUDA TOSHIMITSU;ATSUMI KAZUHIRO;MURAMATSU KENICHI |
发明人 |
FUKUYO FUMITSUGU;FUKUMITSU KENSHI;UCHIYAMA NAOKI;WAKUDA TOSHIMITSU;ATSUMI KAZUHIRO;MURAMATSU KENICHI |
分类号 |
B23K26/38;B23K26/06;B23K26/40;B23K26/42;B28D1/22;B28D5/00;C03B33/023;C03B33/09 |
主分类号 |
B23K26/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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