| 摘要 |
A solder alloy is provided, which consists of, by mass %: 0.6 to 0.75% of Cu; 0.3 to 1.5% of Ag; more than 0.01% but not more than 0.1% of Ge; and the balance being Sn and incidental impurities. Preferably an amount of Ag is 0.5 to 1 mass % Preferably, an amount of Ge is more than 0.01 mass % but not more than 0.06 mass %. The solder alloy is preferably spherically formed into a solder ball. A solder joint in which the solder alloy is joined to a Ni electrode is also provided.
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