| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a piezoelectric wafer whereby piezoelectric substrates keep their shapes even when the piezoelectric substrates are formed by etching the piezoelectric wafer and the piezoelectric substrates can easily be folded off from a piezoelectric wafer main body, and to provide a piezoelectric device. <P>SOLUTION: The piezoelectric wafer 10 is formed with the piezoelectric substrates 20, support parts 40, and the piezoelectric wafer main body 12 through etching. Each piezoelectric substrate 20 is connected to the piezoelectric wafer main body 12 by the support parts 40. That is, the support parts 40 are connected to an end of a face (substrate end face) 22 provided to a side of a substrate end 26 of each piezoelectric substrate 20. Outer side faces 46 of the support parts 40 are consecutively provided along side faces 24 of each piezoelectric substrate 20. Further, inner side faces 42 of the support parts 40 are configured to include first grooves 44 along the substrate end face 22 of each piezoelectric substrate 20. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
