发明名称 CONNECTION METHOD OF PRINTED WIRING BOARDS
摘要 PROBLEM TO BE SOLVED: To provide a simple and inexpensive connection method of printed wiring boards. SOLUTION: The connection method of the printed wiring boards is provided with (a) a process for supplying uncured non-conductive adhesive to regions which contain bonding parts and are previously decided; (b) a process for supplying gold micro balls 14 to the bonding parts through uncured non-conductive adhesive; (c) a process for making a rigid printed wiring board 11 and the flexible printed wiring board 15 confront each other by positioning the bonding parts and sandwiching them, (d) a process for applying previously decided load to the regions while the previously decided regions containing the bonding parts are kept to a previously decided temperature, applying supersonic vibration which is previously decided, and performing intermetal bonding on the bonding parts through the gold micro balls; and (e) a process for heating the region to the previously decided temperature and completely curing adhesive without giving mechanical load to the regions. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007141914(A) 申请公布日期 2007.06.07
申请号 JP20050329740 申请日期 2005.11.15
申请人 NIPPON AVIONICS CO LTD 发明人 NAKATANI NAOTO
分类号 H05K3/36 主分类号 H05K3/36
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