| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a surface-mounting crystal oscillator to promote miniaturization while protecting an IC chip. <P>SOLUTION: In a method of manufacturing a surface-mounting crystal oscillator including a container body 1 having recesses on both principal surfaces, a crystal piece 2 housed and tightly sealed in one recess of the container body 1, an IC chip 3 of which one principal surface is fixed on the bottom of the other recess of the container body 1 through thermocompression bolding using a bump, and a protecting resin 11 for protecting one principal surface of the IC chip 3, the protecting resin 11 is applied over the inner peripheral part of the other recess as a soft resin, and the outer peripheral part of the IC chip 3 is then fixed on the bottom of the other recess while abutting and pressing the outer peripheral part to the soft resin. <P>COPYRIGHT: (C)2007,JPO&INPIT |
