Wiring board with piezoelectric/electrostrictive element and method of manufacturing same

摘要

The board includes a ceramic substrate (112) and a wiring pattern (114) disposed as an electrode layer on the substrate. The wiring pattern has gaps (120) filled with an insulating layer (122) made of cermet. The cermet layer contains a material of the electrode layer. Independent claims are also included for the following: (a) a method of manufacturing a wiring board.