Electronic component mounting apparatus

摘要

The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU (110) sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU (110) judges that a connection tape reaches a pickup position, the CPU (110) drives an X axis drive motor (12x) and a Y axis drive motor (12Y) to move a board recognition camera (17) to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device (117) performs recognition processing, A correction value based on a result of this recognition processing is stored in a RAM (111), and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.