| 摘要 |
A printed circuit board is provided to prevent a short circuit or a bridge phenomenon between pins of an intelligent power module by forming a copper film pattern on a region to be connected to the intelligent power module in a circular shape. A printed circuit board includes a first region(110) to which plural pins of an intelligent power module are connected, a copper film pattern(111) having a hole of a predetermined size to receive the pins, and a white mask(120) adhered to the copper film pattern to improve flow of lead. The copper film pattern is formed in a circular shape to prevent short circuit or bridge phenomenon between the pins by improving the soldering.
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