发明名称 THERMOSTAT TEST APPARATUS
摘要 A heat sensing switch test device is provided to check defective parts generated during assembling a heat sensing switch to a substrate by inspecting the heat sensing switch while the heat sensing switch is assembled to the substrate, thereby preventing assembling of the defective parts. A heat sensing switch test device is composed of a test chamber capable of converting temperature; a test jig(100) for inserting a substrate equipped with a heat sensing switch(S), into the test chamber; and a control box(200) electrically connected with the test jig, to display a switching signal output from the heat sensing switch according to the internal temperature of the test chamber. The test jig comprises a jig base(110) on which the substrate is placed; a side wall(130) vertically installed at one side of the jig base; an opening and closing plate(120) turnably installed at the side wall and opened or shut for the jig base; and plural support rods(140) installed at the opening and closing plate to contact with each upside of the heat sensing switches while the jig base and the opening and closing plate face each other.
申请公布号 KR20070056830(A) 申请公布日期 2007.06.04
申请号 KR20050115951 申请日期 2005.11.30
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JI, YUN SUNG;JIN, BYEONG EUN
分类号 G01R31/28 主分类号 G01R31/28
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