摘要 |
Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment a heat transfer system (106) capable of engaging a processor (104) and adapted to transfer heat from the processor is implemented. A variety of embodiments of the heat transfer system (106, 304, 420, 502, 600, 1300) are presented. For example, several embodiments of a direct-exposure heat transfer system (700, 800, 1000) are presented. In addition, several embodiments of a multi-processor heat transfer systems (900, 110, 1200) are presented. Lastly, several embodiments of heat transfer systems (1400, 1500) deployed in circuit boards are shown. Each of the heat transfer systems is in liquid communication with a heat exchange system that receives heated liquid (124) from the heat transfer system and returns cooled liquid (128) to the heat transfer system. |