发明名称 |
THERMAL INTERFACE APPARATUS, SYSTEMS, AND METHODS |
摘要 |
An apparatus and system, as well as fabrication methods therefor, may include a thermal interface material comprised of an array of carbon nanotubes and a buffer layer disposed between the thermal interface material and one of a die or a heat spreader. In some embodiments the carbon nanotubes may be formed above a buffer layer formed above a surface of the head spreader.
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申请公布号 |
US2007119582(A1) |
申请公布日期 |
2007.05.31 |
申请号 |
US20070668320 |
申请日期 |
2007.01.29 |
申请人 |
INTEL CORPORATION |
发明人 |
ZHANG YUEGANG;GARNER C. M.;BERLIN ANDREW A.;RAO VALLURI;WHITE BRYAN M.;KONING PAUL A. |
分类号 |
F28F1/14;F28F3/02;H01L23/373;H01L23/433 |
主分类号 |
F28F1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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