| 摘要 |
Provided are a high-performance and highly reliable semiconductor device wherein an electronic component is mounted on a substrate (for instance, by flip-chip mounting) by using an adhesive and generation of air bubbles are reduced in the adhesive, and a method for manufacturing such semiconductor device at a low cost with high efficiency. The method for manufacturing the semiconductor device includes at least a supplying step, a flow casting step, and a hardening step. In the supplying step, the adhesive (22) for bonding the electronic component on the substrate (10) is supplied at least on a part on the substrate (10) between the electronic component having bumps and the substrate (10) having bonding pads (12) corresponding to the bumps. In the flow casting step, the adhesive (22) is flow-cast by a flow-casting means (for instance, a jetting nozzle) (30) to satisfy an inequality of S<SUB>1</SUB>/S<SUB>0</SUB>>1, wherein, S<SUB>0</SUB> is a total contact area of the supplied adhesive (22) with the substrate (10), and S<SUB>1</SUB> is a total noncontact area of the adhesive (22) with the substrate (10) after flow-casting. In the hardening step, the adhesive (22) is hardened, while bringing the adhesive (22) into contact with the electronic component and the substrate (10), in a status where the bumps are permitted to abut to the bonding pads (12). |
