| 摘要 |
An apparatus for vaporizing a liquid for subsequent thin film deposition on a substrate. The apparatus comprises a housing with an inlet and an outlet and a liquid reservoir. A mechanism controls the liquid level in the reservoir to a substantially constant level. A gas flow passageway extends along side a porous metal wall with interstitial spaces for containing liquid from the reservoir and with a package for a carrier gas to flow along side the porous metal wall, forming a gas/vapor mixture suitable for thin film deposition.
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