CIRCUIT MODULE AND METHOD FOR FABRICATING THE SAME

摘要

[PROBLEMS] To provide a method for fabricating a circuit module easily fabricated and having a good shieldability. [MEANS FOR SOLVING PROBLEMS] A module board (1) in a collective board form is prepared, and circuit components (4) are mounted on the module board (1). An insulating resin layer (20) is formed on the entire upper surface of the module board (1) so as to surround the circuit components (4), and an upper surface shield layer (21) is formed on the upper surface of the insulating resin layer (20). A first through-hole (16) extending in the thickness direction is formed in the module board and part of the child board boundary line (BL) of the insulating resin layer. A first electrode film (12b) connected to the upper surface shield layer is formed on the inner surface of the first through-hole (16) and the first through-hole (16) is filled with a filling material (15). A second through-hole (17) extending in the thickness direction is formed in the other portion of the child board boundary line (BL), and a second electrode film (12a) connected to the upper surface shield layer (21) and the first electrode film (12b) is formed in the inner surface of the second through-hole. The filling material (15) with which the first through-hole is filled is cut along the child board boundary line to divide the module board (1) into child boards, thereby obtaining circuit modules A.