| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method without causing a multilayer board embedded with electronic components to be warped. <P>SOLUTION: A first substrate, a sheet, and a second substrate are heated and crimped for integration. The first substrate is composed of a thermosetting resin after curing while a land provided on the upper surface and the electrode of electronic components are connected and fixed by a connecting/fixing material. The sheet is arranged on the upper surface of the first substrate and is made of woven cloth or nonwoven cloth impregnated with resin having thermal flow behavior. The second substrate is arranged on the upper surface of the sheet and is composed of the thermosetting resin after curing. <P>COPYRIGHT: (C)2007,JPO&INPIT |
