| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cutting method of a quartz substrate constituted so as not to almost discharge cut refuse in the cutting of the quartz substrate. <P>SOLUTION: The cutting method of the quartz substrate has a process for measuring the thickness of the quartz substrate 1 set to a laser processing device 20, a process for adjusting the condensing point 45 in the quartz substrate 1 of a laser beam 23 being a femtosecond laser and a process for scanning the laser beam 23 in order to form a modified region 50 along a cutting schedule position. In the process for scanning laser beam 23, the condensing point 45 is successively moved three times in the thickness direction of the quartz substrate 1 to form the modified region 50 to the whole surface of the quartz substrate 1 in its thickness direction. <P>COPYRIGHT: (C)2007,JPO&INPIT |
