| 摘要 |
PROBLEM TO BE SOLVED: To provide a transmission/reception chip package capable of achieving miniaturization of a portable communication device and cost reduction thereof without deteriorating isolation or heat radiation characteristic. SOLUTION: Transmission/reception packages 12, 14 are configured so that transmission chips 12T, 14T each having a filter for transmission and reception chips 12R, 14R each having a filter for reception are laminated and joined. The transmission chips 12T, 14T of the transmission/reception packages 12, 14 are mounted on an interposer substrate 16 having a built-in impedance matching circuit 18 so that heat radiation characteristic may not be deteriorated. COPYRIGHT: (C)2007,JPO&INPIT
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