METHOD FOR REMOVING A PASSIVATION LAYER PRIOR TO DEPOSITING A BARRIER LAYER IN A COPPER METALLIZATION LAYER

摘要

By forming a thin passivation layer after the formation of openings connecting to a highly reactive metal region, any queue time effects may be significantly reduced. Prior to the deposition of a barrier/adhesion layer, the passivation layer may be efficiently removed on the basis of a heat treatment so as to initiate material removal by evaporation.