| 摘要 |
A semiconductor device of the present invention is structured such that solder balls for packaging are fixed onto leads protruding from a package to obviate drawbacks inherent in the conventional lead frame type semiconductor device, wherein it is difficult to correspond to the layout of the increased number of pins due to an occurrence of flexure of the lead, and protrusions of the lead terminals from the package resin are disadvantageous for downsizing. <IMAGE> |
