| 摘要 |
PROBLEM TO BE SOLVED: To surely prevent the penetration of a liquid to a flexible section passed through a slit formed to an outer-layer board, and to easily remove the unnecessary section of the outer-layer board in a manufacturing method for a multilayer printed circuit board by a slit construction method. SOLUTION: The multilayer printed circuit board is manufactured by the slit construction method forming slits 66 to a section 64 corresponding to the flexure of the outer-layer board 60 before the laminating process of an inner-layer board 30 and the outer-layer board 60, and removing the section 64 corresponding to the flexure from the outer-layer board 60 by the slits 66 after the laminating process. In the manufacturing method for the multilayer printed circuit board, the flexure (such as shielding layers 40) of the inner-layer board 30 is protected from a subsequent liquid process by closing the slits 66 of the outer-layer board 60 in a liquid-tight manner by tapes 67 before the laminating process. COPYRIGHT: (C)2007,JPO&INPIT |
