| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a solder bump capable of suppressing cracks due to thermal stress etc. by improving strength, and to provide a method of manufacturing the same. <P>SOLUTION: On a semiconductor substrate having an electronic circuit formed thereon, a base layer is formed so as to be electrically connected to the electronic circuit and protrude from the surface of semiconductor substrate, and the bump made of solder is formed so as to be bonded on the surface of a portion protruding from the surface of the substrate of the base layer and formed. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
