METHOD FOR BONDING BETWEEN ELECTRICAL DEVICES USING ULTRASONIC VIBRATION
摘要
The present invention is to provide a method for bonding between electrical devices, including the steps of: aligning electrodes on a bonded area of an upper electrical device and a lower electrical device to be bonded; and curing of adhesives by applying ultrasonic energy to the adhesives between the upper electrical device and the lower electrical device.
申请公布号
WO2007061216(A1)
申请公布日期
2007.05.31
申请号
WO2006KR04912
申请日期
2006.11.22
申请人
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY;PAIK, KYUNG-WOOK;YIM, MYUNG-JIN;KIM, HYOUNG-JOON;LEE, KI-WON