| 摘要 |
PROBLEM TO BE SOLVED: To provide conductive paste with a contained metal component soluble to a solvent, enabled to be micro-sized and thinned, and without risk of having toxic substance generated at baking. SOLUTION: The conductive paste forming a conductive film on a base body by baking contains a metal element M (the formal oxidation number: +m) and an organic acid group A (the ionic valence number: -p), as well as at least base organic acid metal salt, as a metal component, expressed in a composition formula of: AxMy(OH)z-nH<SB>2</SB>O (where, x≥1, z≥1, m×y=p×x+z, n=an integer of 0 or more or a half-integer). COPYRIGHT: (C)2007,JPO&INPIT
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