| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component package for relaxing stress applied to electronic components and preventing the electronic components from being damaged. SOLUTION: The electronic component package comprises a packaging substrate 9, an external electrode 11 arranged on the packaging substrate 9, and an electronic component (SAW duplexer) 7 packaged on the packaging substrate 9 via the external electrode 11. The electronic component 7 comprises a component substrate 12, an element (IDT electrode) 13 arranged on the lower surface of the component substrate 12, and a component cover 15 that covers the lower surface side of the component substrate 12 and has a recess 14 at a part facing the element 13. A cushion 16 for covering the electronic component 7 and further a mold resin 10 for covering the outer periphery of the cushion 16 are provided at the outer periphery of the electronic component 7 on the packaging substrate 12. By reducing the modulus of elasticity of the cushion 16 as compared with that of the mold resin 10, stress applied to the electronic component in mold machining can be relaxed, thus preventing damage, such as strain and cracks. COPYRIGHT: (C)2007,JPO&INPIT
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