发明名称 |
Wiring board, electronic component mounting structure, and electronic component mounting method |
摘要 |
A flip chip mounting method for improving the accuracy of positioning of a semiconductor chip and avoiding a short circuit between protruding electrodes even when the protruding electrodes are formed at smaller spacings. The method comprises: placing a semiconductor chip on a wiring board, the semiconductor chip having protruding electrodes formed at a relatively small spacing and at a relatively large spacing, the wiring board having electrode pads corresponding to the respective protruding electrodes and solder pieces formed on the respective pads; heating the semiconductor chip and the wiring board to a temperature at which only the solder pieces on the electrode pads of greater spacing melt; performing self alignment of the semiconductor chip by the melted solder pieces; and heating the semiconductor chip and the wiring board further to a temperature at which the protruding electrodes and the solder pieces on the electrode pads of smaller spacing melt.
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申请公布号 |
US2007119618(A1) |
申请公布日期 |
2007.05.31 |
申请号 |
US20060600928 |
申请日期 |
2006.11.16 |
申请人 |
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发明人 |
NISHITANI YUJI;OHDE TOMOSHI |
分类号 |
H05K1/16 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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