PROCESS FOR PRODUCING BASE MATERIAL HOLDING TOOL FOR WIRING BOARD, BASE MATERIAL HOLDING TOOL FOR WIRING BOARD, INTERMEDIATE MATERIAL FOR WIRING BOARD, AND PROCESS FOR PRODUCING WIRING BOARD

摘要

This invention provides a process for producing a base material holding tool for a wiring board, comprising an adhesive organic material layer provided on the surface of a holding tool body, that can realize improved adhesion between the organic material layer and the holding tool body, can regulate the adhesion of the organic material layer without varying the composition of the resin for organic material layer formation, and can accurately regulate the thickness even in the formation of a plurality of regions different from each other in adhesion in the organic material layer. The production process is characterized by comprising subjecting the surface of a holding tool body (2) to substrate treatment with a substrate treatment agent containing an adhesion modifier component for regulating the adhesion of an organic material layer (3), and then stacking an adhesive organic material layer (3). Accordingly, the adhesion of the organic material layer (3) can be regulated without varying the composition of a resin used for organic material layer (3) formation by the adhesive modifier component contained in the substrate treatment agent, and an organic material layer (3) having various adhesive properties can be formed by a resin having an identical composition.