| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a three-dimensional circuit board which increases the productivity as well as improving the accuracy of circuit formation. <P>SOLUTION: In this method of manufacturing a three-dimensional circuit board, a metal hoop material 1 with positioning pilot hole 2 formed therein is employed. Since 3D structures 3 are formed on the hoop material 1 with a preset interval maintained therebetween in a lengthwise direction of the hoop material 1, the series of processes is conducted on a roll 1A (winding of the hoop material 1) basis, which results in that handling between the individual processes can is more easily while increases of troubles and manufacturing costs are prevented. Since the positioning pilot holes 2 serve to facilitate accurate positioning, plating and/or laser processing is conducted continuously with high precision while a cycle time for positioning is reduced. <P>COPYRIGHT: (C)2007,JPO&INPIT |
