发明名称 PRINTING SOLDER INSPECTION APPARATUS
摘要 PROBLEM TO BE SOLVED: To inspect a printing mode of printed cream solder before heating and to perform correction work in the position in a rejected case. SOLUTION: A printing solder inspection apparatus is provided with an inspecting means having an inspection head 20 which is arranged to freely move an upper part of a substrate 12 and detects a position and height of cream solder 13 printed on the substrate 12, a printed solder removing means 24 which is integrally disposed with the inspection head 20, and a cream solder supplementing means 26 which is integrally arranged with the inspection head 20. Cream solder 13 before heating printed on the substrate 12 is inspected and it can be corrected. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007134406(A) 申请公布日期 2007.05.31
申请号 JP20050323753 申请日期 2005.11.08
申请人 ANRITSU CORP 发明人 MASUDA NORIHIKO
分类号 H05K3/34;B23K1/00;B23K3/06;B23K101/42;G01B11/00;G01B11/02;G01N21/956 主分类号 H05K3/34
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