Trägermaterial für elektronische Hochleistungs-Bauelemente in SMD-Bauform und ein damit hergestelltes elektronisches Hochleistungs-Bauelement

摘要

The support material has a metal core (7), which is surrounded by an insulation layer (10,11). The insulation layer has a top connection structure (8) and a bottom connection structure (9). A metal coating (4) is fitted on the upper connection structure. The insulation layer has feedthroughs (5,6). The metal coating is preferably an alloy that can be easily soldered, e.g. nickel-gold or nickel-palladium-gold. An Independent claim is included for an electronic high-dissipation component using the support material.