| 摘要 |
PURPOSE:To allow reliable production with lower cost, thin-type and miniatuarization by removing a resist film with coating material and its ground layer under it after plating. CONSTITUTION:The surface of a primary molded product 1 is made rough, and the pretreatment of the primary molded product is performed by providing a catalyst such as palladium, gold, silver, and plutinum. This primary molded product 1 undergoes non-electrolytic plating by a non-electrolytic copper plating or non-electrolytic nickel plating method as a primary plating. Then, the plated primary molded product 1 is coated with a resist film 21 to form a secondary molded product 2, with other parts to be secondary-plated where a plating film 31 is to be formed being left. Further, the resist film 21 is removed and the ground layer 11 under the resist film is removed after this secondary molded product 2 is plated, thereby allowing thin-type product and miniatuarization and reliably manufacturing a part-plated product with lower cost. |
