发明名称
摘要 PROBLEM TO BE SOLVED: To provide a visible light sensitive positive resin composition, to be used for a photoresist material, superior in solubility in solvents, dissolution speed, acid diffusivity transparency, and heat stability by using a specified copolymer. SOLUTION: The visible light sensitive positive resin composition comprising a photosensitive resin, an olefinic unsaturated compound having ether bond, a photoacid-generator, and a photosensitizer contains as the photosensitive resin, the copolymer of structural units each represented by formulae I-III, in which a=0.05∼0.7, b=0.15∼0.8, and c-0.01∼0.5, and a+b+c=1; R1 is an H atom or a methyl group; and R2 is a 1-6C straight or branched and optionclly substituted alkyl or 1-6C straight or branched hydroxyalkyl group.
申请公布号 JP3921010(B2) 申请公布日期 2007.05.30
申请号 JP19990187329 申请日期 1999.07.01
申请人 发明人
分类号 G03F7/027;G03F7/039;C08F2/50;C08F212/14;C08F220/06;C08F220/10;C08L25/18;C08L33/00 主分类号 G03F7/027
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