| 摘要 |
The present invention provides a thermosetting resin composition superior with respect to all characteristics of dielectric characteristics, heat resistance, moisture resistance, electrolytic corrosion resistance, adhesiveness with a copper foil, chemical resistance and flame retardancy using a halogen-free flame retardant, its use, and for example, a prepreg, laminated board and printed wiring board. The present invention relates to: (1) a resin thermosetting resin composition comprising: (A) a phenol-modified cyanate ester oligomer obtained by reacting a cyanate compound (a) containing two or more cyanato groups in a single molecule, and (b) a phenol compound represented by the formula (I) and/or formula (II), such that a blending equivalence ratio of hydroxyl group (b)/cyanato group (a) is within a range of 0.01 to 0.3, and the monomer conversation rate of cyanate compound (a) containing two or more cyanato groups in a single molecule is 20 to 70%, (B) an epoxy resin containing two or more epoxy groups in a single molecule, and (C) at least one member selected from a metal salt of a di-substituted phosphinic acid and a phosphazene compound as a flame retardant; (2) a thermosetting resin composition comprising: components (A), (B), (C), (D) a silicone polymer containing at least one member of siloxane unit selected from a tri-functional siloxane unit represented by the formula: RSiO<SUB>3/2 </SUB>(wherein, R represents an organic group, and the R groups in the silicone polymer may be mutually the same or different) and a tetra-functional siloxane unit represented by the formula: SiO<SUB>4/2</SUB>, having a degree of polymerization of 7,000 or less, and having one or more functional groups on its terminals that react with hydroxyl groups, and (E) an organic filler; and, a prepreg obtained by using the same, and a metal-clad laminated board and printed wiring board obtained by using the same. |
