发明名称 |
Circuit substrate manufacturing method |
摘要 |
A circuit substrate manufacturing method including the steps of preparing a substrate on which a metallic foil is formed in a releasable state, forming a build-up wiring on the metallic foil, obtaining a circuit member having a structure that the build-up wiring is formed on the metallic foil by releasing the metallic foil from the substrate, and exposing a lowest wiring layer of the build-up wiring by removing the metallic foil of the circuit member.
|
申请公布号 |
US7222421(B2) |
申请公布日期 |
2007.05.29 |
申请号 |
US20050034985 |
申请日期 |
2005.01.14 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
NAKAMURA JUNICHI |
分类号 |
H05K3/36;H05K3/46;H05K1/03;H05K1/11;H05K3/00;H05K3/02;H05K3/06;H05K3/20;H05K3/34;H05K3/38;H05K3/40 |
主分类号 |
H05K3/36 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|