发明名称 |
Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package |
摘要 |
A leadless type semiconductor package includes a plate-like mount, and at least one semiconductor chip mounted on the plate-like mount such that a bottom surface of the semiconductor chip is secured to the plate-like mount, and the semiconductor chip has at least one electrode pad formed on a top surface thereof. The package further includes at least one flat electrode electrically connected to the electrode pad, and a molded resin enveloper for completely sealing and encapsulating the semiconductor chip. The molded resin enveloper further partially seals and encapsulates the flat electrode such that a part of the flat electrode is exposed as an outer electrode pad on a top surface of the molded resin enveloper.
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申请公布号 |
US7224045(B2) |
申请公布日期 |
2007.05.29 |
申请号 |
US20040869949 |
申请日期 |
2004.06.18 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
TABIRA YUKINORI;TANAKA TAKEKAZU |
分类号 |
H01L23/28;H01L23/495;H01L21/56;H01L23/12;H01L23/31;H01L23/50;H01L25/07;H01L25/18 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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