摘要 |
A positive type photoresist composition suitable for light in the wavelength region of 170 nm to 220 nm, high in sensitivity, excellent in adhesion and giving a good resist pattern profile, which comprises a resin having an ester group represented by the following general formula [I] in its molecule and a compound generating an acid by irradiation of an active light ray or radiation: wherein R<SUB>1 </SUB>represents a hydrogen atom, an alkyl group or a cycloalkyl group; and R<SUB>2 </SUB>and R<SUB>3</SUB>, which may be the same or different, each represents a hydrogen atom, an alkyl group, a cycloalkyl group or -A-R<SUB>4</SUB>, and R<SUB>2 </SUB>and R<SUB>3 </SUB>may combine together to form a ring, wherein R<SUB>4 </SUB>represents a hydrogen atom, an alkyl group or a cycloalkyl group, R<SUB>4 </SUB>and R<SUB>2 </SUB>or R<SUB>3 </SUB>may combine together to form a ring, and A represents an oxygen atom or a sulfur atom.
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