发明名称 Housing for vibration sensitive circuits
摘要 Disclosed is an improved housing being comprised of a substrate and a cover that is plated to provide RF shielding. The substrate and cover are constructed of a like material to keep the coefficients of vibration approximately identical. Preferably, the substrate and cover material are ceramic thereby providing a rigid structure that minimizes vibration degradation.
申请公布号 US4736069(A) 申请公布日期 1988.04.05
申请号 US19860913206 申请日期 1986.09.30
申请人 MOTOROLA, INC. 发明人 MULLINS, AARON B.
分类号 H05K7/14;H05K9/00;(IPC1-7):H05K9/00 主分类号 H05K7/14
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