发明名称 APPARATUS FOR TREATING SUBSTRATE
摘要 A substrate processing apparatus is provided to perform a predetermined treatment on a large sized substrate and to perform the substrate treatment in a uniform temperature range by using a plurality of sub-processing modules separated from each other. A substrate processing apparatus includes a loading/driving unit and a processing module. The loading/driving unit(10) is used for loading stably a treatment object substrate and moving the substrate in a first direction. The processing module is installed on the loading/driving unit. The processing module is composed of a plurality of sub-processing modules(20a,20b,20c) spaced apart from each other. The processing module is used for supplying plasma reactants onto the substrate.
申请公布号 KR100724613(B1) 申请公布日期 2007.05.28
申请号 KR20050119314 申请日期 2005.12.08
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 ANDREY USHAKOV;LIM, KYUNG CHUN;LEE, SANG HO
分类号 H01L21/02;H01L21/304;H01L21/3065 主分类号 H01L21/02
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