发明名称 |
APPARATUS FOR TREATING SUBSTRATE |
摘要 |
A substrate processing apparatus is provided to perform a predetermined treatment on a large sized substrate and to perform the substrate treatment in a uniform temperature range by using a plurality of sub-processing modules separated from each other. A substrate processing apparatus includes a loading/driving unit and a processing module. The loading/driving unit(10) is used for loading stably a treatment object substrate and moving the substrate in a first direction. The processing module is installed on the loading/driving unit. The processing module is composed of a plurality of sub-processing modules(20a,20b,20c) spaced apart from each other. The processing module is used for supplying plasma reactants onto the substrate.
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申请公布号 |
KR100724613(B1) |
申请公布日期 |
2007.05.28 |
申请号 |
KR20050119314 |
申请日期 |
2005.12.08 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
ANDREY USHAKOV;LIM, KYUNG CHUN;LEE, SANG HO |
分类号 |
H01L21/02;H01L21/304;H01L21/3065 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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