发明名称 |
Solid state imaging device and method for manufacturing the same |
摘要 |
A solid state imaging device includes: a solid state imaging element including a light receiving element, a microlens formed above the light receiving element, a first transparent layer formed on the microlens and a second transparent layer formed on or above the microlens and harder than the first transparent layer; a transparent component formed above the second transparent layer; and an adhesive layer for bonding the second transparent layer and the transparent component. The hard second transparent layer prevents the occurrence of scratches during a dicing step.
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申请公布号 |
US2007117349(A1) |
申请公布日期 |
2007.05.24 |
申请号 |
US20060584560 |
申请日期 |
2006.10.23 |
申请人 |
KOMATSU TOMOKO;MASUDA TOMOKI;TERANISHI NOBUKAZU |
发明人 |
KOMATSU TOMOKO;MASUDA TOMOKI;TERANISHI NOBUKAZU |
分类号 |
H04N5/225;H01L21/30;H01L23/02 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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