发明名称 MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board which has highly precise resistance value of a resistor and does not need trimming, and to provide the method of manufacturing the wiring board. <P>SOLUTION: In the multilayer wiring board, a wiring pattern 5 is arranged in one ceramic sheet 2b positioned between laminated layers of a laminated substrate 1, and the resistor 6 is disposed in the other ceramic sheet 2c positioned between the laminated layers. Since the ceramic sheets 2b and 2c are laminated and the resistor 6 is connected to the wiring pattern 5, the resistor 6 can be formed on the flat ceramic sheet 2c where the wiring pattern 5 does not exist. Thereby, a blot by the wiring pattern 5 is eliminated, and the wiring board can be obtained with sufficient precision of the resistance value and without need of trimming. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007128962(A) 申请公布日期 2007.05.24
申请号 JP20050318385 申请日期 2005.11.01
申请人 ALPS ELECTRIC CO LTD 发明人 MIURA HISAO
分类号 H05K3/46 主分类号 H05K3/46
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