<p>A moisture sensor includes interdigitated first and second electrodes formed in trenches 26. A porous low-k dielectric 20 is provided between the electrodes. The electrodes are of Cu 30 surrounded by a barrier layer 28,32 to protect the Cu from corrosion. TiN may be used as barrier layer 28 and selectively deposited barrier material such as CoWB, MoWB or NiMoP as barrier layer 32.</p>
申请公布号
WO2007057794(A1)
申请公布日期
2007.05.24
申请号
WO2006IB53907
申请日期
2006.10.24
申请人
KONINKLIJKE PHILIPS ELECTRONICS N.V.;HOOFMAN, ROMANO;MICHELON, JULIEN, M., M.